Chinese IC packaging firm ECHINT bags almost $137m in Series B round

Chinese IC packaging firm ECHINT bags almost $137m in Series B round

Image Source: ECHINT's official WeChat account.

ECHINT, which engages in advanced integrated circuit (IC) packaging and testing, has secured 1 billion yuan ($136.9 million) in a Series B round co-led by venture capital firm Matrix Partners China. 

Edited by: Joymitra Rai

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