Huawei to plan $2b bond issue as China tech funding booms

Journalists follow the presentation of Huawei's new smartphone, the Mate S, ahead of the IFA Electronics show in Berlin, Germany, September 2, 2015. REUTERS/Hannibal Hanschke/Files

Huawei Technologies Co., the world’s third-biggest smartphone maker, plans to sell at least $2 billion of bonds amid a boom in financing for Chinese technology companies, a person familiar with the matter said.

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