IoT-based chips specialist Mlink has secured 100 million yuan ($15 million) in a Series B+ round of financing led by Beijing Integrated Circuit Chip Fund, per a company statement on Wednesday.
Existing investor SIG Capital re-upped in the round. New investors – Yangtze River Industry Fund, Enlight Growth Partners and Sichuan Entrepreneur Fund – also participated in the financing.
Beijing-based Mlink has been engaged in intelligent chips design that primarily caters to telecom, 5G network, and internet of vehicles.
Earlier in 2020, Mlink has had completed a similar-sized Series A+ round funding. The firm is also backed by TusStar, Changjiang Securities, ECC Capital, C.Domain, Landstone Capital, Hefei Hi-Tech VC, and Prorich Capital.
CHINA DEAL MONITOR
DealStreetAsia has also put together a table listing out all prominent venture capital transactions in the Greater China region from August 31-September 01, 2021.
