Goldstone, CIIF co-lead $392m Series C funding in Chinese AIoT chip maker ESWIN

Goldstone, CIIF co-lead $392m Series C funding in Chinese AIoT chip maker ESWIN

Photo by Alexandre Debiève on Unsplash

Eudora Wang

01 December, 2021

AIoTCIIFESWINGoldstone Investmentsemiconductor

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