Goldstone, CIIF co-lead $392m Series C funding in Chinese AIoT chip maker ESWIN

Photo by Alexandre Debiève on Unsplash

Beijing ESWIN Technology Group, a Chinese provider of artificial intelligence of things (AIoT) chips and services, has pocketed 2.5 billion yuan ($392.4 million) in a Series C round of financing to step up R&D investment and talent recruitment.

The funding round was jointly led by Goldstone Investment, the private investment subsidiary of Chinese investment bank CITIC Securities, and China Internet Investment Fund (CIIF), a 100 billion yuan ($15.7 billion) fund jointly established by China’s ministry of finance.

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