China's Lihao raises $307m Series B round to speed up chip R&D, build new facilities

China's Lihao raises $307m Series B round to speed up chip R&D, build new facilities

Photo by Infralist on Unsplash

China’s Lihao Semiconductor, a manufacturer of semiconductor materials, has completed its Series B funding round at 2.2 billion yuan ($307.4 million) to invest in technological R&D and the construction of a new production facility.

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