China’s ESWIN Material nets over $464m from CITIC, ZWC Partners, others

Xi’an ESWIN Material, the integrated circuit (IC) and solutions unit of Beijing ESWIN Technology Group, has closed its Series B round of financing after raising over 3 billion yuan ($464 million),  it said in a statement on Monday. 

The round was jointly led by CITIC Securities and Goldstone Investment, a private investment arm of CITIC Securities. 

Bring stories like this into your inbox every day.

Sign up for our newsletter - The Daily Brief
Subscribe to Newsletter