Chinese chip maker ESWIN nets $283m in Series B round led by IDG, Legend Capital

Chinese chip maker ESWIN nets $283m in Series B round led by IDG, Legend Capital

Source: Brian Kostiuk/Unsplash

Beijing ESWIN Technology Group, a Chinese supplier of semiconductor products and services, is collecting over 2 billion yuan ($283 million) in a Series B round of financing led by IDG Capital and Legend Capital.

Transactions of the first tranche of the funding at 1 billion yuan ($141 million) was already completed, said IDG Capital in a WeChat post on Monday.

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