Hong Kong: Hon Hai plans $1.5b IPO to spin off Foxconn Interconnect Technology unit

Hong Kong: Hon Hai plans $1.5b IPO to spin off Foxconn Interconnect Technology unit

Fiona Lau

17 December, 2015

Bank of AmericaBofA Merrill LynchChina International Capital Corpcredit suisseFoxconn Technology Co. LtdHon Hai Precision Industry CoIFR

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