TSMC weighs advanced chip packaging capacity in Japan

TSMC weighs advanced chip packaging capacity in Japan

An employee walks in front of the logo of Taiwan Semiconductor Manufacturing Co Ltd (TSMC) at its headquarters in Hsinchu, northern Taiwan, November 19, 2015. REUTERS/Pichi Chuang

Taiwan’s TSMC is looking at building advanced packaging capacity in Japan, according to two sources familiar with the matter, a move that would add momentum to Japan‘s efforts to reboot its semiconductor industry.

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